tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 1 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? applications ? cellular handsets ? cordless phone ? lnbs ? catv set top boxes product features functional block diagram ? snap - back esd protection ? low clamp voltages 15 or 30 v ? low trigger voltages 18, 25, or 41 v ? two bidirectional protection lines ? fast response time , under 1 ns. ? esd protection: iec 61000 - 4 - 2, level 1 jedec hbm, 8 kv ? low capacitance 0.22 pf ? thin small leadless smt package (a = 1.8 mm 2 ) general descriptio n pin configuration the tqp200002 esd protection device is fabricated in gaas mesfet technology and has been especially developed for high frequency applications. it delivers bi - directional protection with very low leakage currents and extremely low cap acitance. it is ideally suited for cellular handsets, cordless phones, and broadband applications like catv set top boxes and lnbs. snap - back characteristics: symbol function vi measured between pin 1 and pin 3. v2 measured between pin 1 and pin 2. v3 measured between pin 2 and pin 3. ordering info rmation part no. description tqp 200002 esd protector diode tqp200002 - pcb - 75 75 ohm evaluation board tqp200002 - pcb - 50 50 ohm evaluation board standard t/r size = 1 0, 000 pieces on a 13 reel.
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 2 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? specifications absolute maximum ratings parameter rating storage temperature - 65 to +150 o c total power dissipation 600 mw iec 61000 - 4 - 2 air discharge 3000 v iec 61000 - 4 - 2 contact discharge 3000 v jedec human body model (hbm) 8000 v operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units v d13 - 7 -- 7 v v d12 - 7 -- 7 v v d23 - 17 -- 17 v tcase - 40 85 o c t j (for >10 6 hours mttf) 160 o c electrical specifications are measured at specified test conditions. specifications are not guara nteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: 25oc parameter conditions min typical max units trigger voltage, v 1 p1,3 13 18 23 v clamp voltage, v cl1 p1,3 10 15 20 v leakage curr ent, i leak1 1 v 20 na leakage current, i leak1 15 v 500 na capacitance, c 1 (1v, 10 mhz) 290 ff trigger voltage, v 2 p1,2 20 25 30 v clamp voltage, v cl 2 p1,2 10 15 20 v leakage current, i leak 2 1 v 20 na leakage current, i leak2 15 v 500 na ca pacitance, c 2 (1v, 10 mhz) 290 ff trigger voltage, v 3 p2,3 36 41 46 v clamp voltage, v cl 3 p2,3 20 30 40 v leakage current, i leak 3 1 v 15 na leakage current, i leak3 15 v 300 na capacitance, c 3 (1v, 10 mhz) 220 ff
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 3 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? device characteri zation data cap id=c1 c=shunt_c cap id=c2 c=shunt_c ind id=l1 l=series_ind cap id=c3 c=series_c ind id=l2 l=series_ind res id=r1 r=parallel_r port p=1 z=50 ohm port p=2 z=50 ohm small signal model: pin 2 to pin 3 pin 2 to pin 3 small signal element value unit series_c 0.22 pf shunt_c_in** 0.08 pf shunt_c_out** 0.01 pf series_ind 0.2 nh parallel_r 230 m? **note: values of input and output shunt capacitances are dependent upon board material and the board pad sizes, and will be layout dependent
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 4 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? typical performance 50- 1200 mhz - 1.0 - 0.8 - 0.6 - 0.4 - 0.2 0.0 0.2 0.4 0.6 0.8 1.0 200.00 400.00 600.00 800.00 1000.00 1200.00 il (db) frequency (mhz) insertion loss vs. frequency vtr = 18v vtr = 25v vtr = 41v vtr = 41v vtr = 18v vtr = 25v - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 0 200.00 400.00 600.00 800.00 1000.00 1200.00 s11 (db) frequency (mhz) s11 vs. frequency vtr = 18v vtr = 25v vtr = 41v vtr = 18v vtr = 41v vtr = 25v - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 0 200.00 400.00 600.00 800.00 1000.00 1200.00 s22 (db) frequency (mhz) s22 vs. frequency vtr = 18v vtr = 25v vtr = 41v vtr = 18v vtr = 25v vtr = 41v distortion performance : acpr test conditions: acpr data was taken against a baseline obtained for the tat8857 at 990 mhz. channel plan: 4 combined channels, 256 qam m odulation per docsis 3.0. 60 62 64 66 68 70 57.00 58.00 59.00 60.00 61.00 62.00 63.00 acpr (dbc) pout (dbmv/ch) acpr3 vs. pout, fr = 990 mhz tat8857 baseline baseline + tqp (vtr = 18v) baseline + tqp (vtr = 25v) baseline + tqp (vtr = 41v) note: acpr3 C 6 mhz from channel block edge, to 12 mhz from channel block edge. trigger voltage v1 = 18v v2 = 25v v3 = 41v insertion loss db 0 .3 0.25 0.25 input return loss db 19 21 21 output return loss db 19 21 21
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 5 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? distortion performance : ctb/cso test conditions: distortion data was taken against baselines obtained for the tat8857 and an industry leading ga n module. c hannel plan: 79 ch. ntsc + qam to 1 ghz, with 13 db tilt at input. 65 70 75 80 0.00 100.00 200.00 300.00 400.00 500.00 600.00 ctb (dbc) frequency (mhz) ctb vs. frequency, pout = 54 dbmv/ch. tat8857 baseline baseline + tqp (vtrig = 18 v) baseline + tqp (vtrig = 25 v) baseline + tqp (vtrig = 41 v) 45 50 55 60 0.00 100.00 200.00 300.00 400.00 500.00 600.00 ctb (dbc) frequency (mhz) ctb vs. frequency, pout = 64 dbmv/ch. tat8857+gan hybrid baseline baseline + tqp (vtr = 18 v) baseline + tqp (vtr = 25 v) baseline + tqp (vtr = 41 v) 65 70 75 80 0.00 100.00 200.00 300.00 400.00 500.00 600.00 cso (dbc) frequency (mhz) csol vs. frequency, pout = 54 dbmv/ch. tat8857 baseline baseline + tqp (vtr = 18v) baseline + tqp (vtr = 25 v) baseline + tqp (vtr = 41v) 55 60 65 70 0.00 100.00 200.00 300.00 400.00 500.00 600.00 cso (dbc) frequency (mhz) csol vs. frequency, pout = 64 dbmv/ch. tat8857+gan hybrid baseline baseline + tqp (vtr = 18v) baseline + tqp (vtr = 25v) baseline + tqp (vtr = 41v) 65 75 85 95 0.00 100.00 200.00 300.00 400.00 500.00 600.00 cso (dbc) frequency (mhz) csoh vs. frequency, pout = 54 dbmv/ch. tat8857 baseline baseline + tqp (vtr = 18v) baseline + tqp (vtr = 25v) baseline + tqp (vtr = 41v) 50 60 70 80 0.00 100.00 200.00 300.00 400.00 500.00 600.00 cso (dbc) frequency (mhz) csoh vs. frequency, pout = 64 dbmv/ch. tat8857+gan hybrid baseline baseline + tqp (vtr = 18v) baseline + tqp (vtr = 25v) baseline + tqp (vtr = 41v)
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 6 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? applications information evaluation board layout t he tqp200002 75 ohm evaluation board features a 2 layer coplanar design using fr4 , ? r = 3.7 , with an ove rall board thickness of 0.028 . metal layer is 1 - oz copper. microstrip line details: width = .0 23 , spacing = .0 32. for further technical information, refer to www.triquint.com
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 7 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? mechanical information package information and dimensions th e tqp200002 package is lead - free/rohs - complia nt.
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 8 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? tape and reel information t/slp 1.2x1.5 mm wide ca rrier and cover tape dimensions part feature symbol size (in) size (mm) cavity length a0 0. 053 1.35 width b0 0. 068 1.75 depth k0 0.0 40 1. 02 pitch p1 0.157 4.00 distance between centerline cavity to perforation length direction p2 0.079 2.00 cavi ty to perforation width direction f 0.138 3.50 cover tape width c 0.213 5.40 carrier tape width w 0.315 8.00 reel dimensions:
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 9 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? product label and marking p art marking: white ink or laser mark line 1: xx = last 2 digits of tr iquint assembly lot number triquint standard customer label (no cpn) carton label
tqp200002 esd protection device data sheet: rev e 0 4 /1 6 /1 3 - 10 of 11 - disclaimer: subject to change without notice ? 20 11 triquint semiconductor, inc. connecting the digital w orld to the global network ? product compliance information esd information esd rating: class 3b value: passes 8 k v min. test: human body model (hbm) standard: jedec standard jesd22 - a114 solderability compatible with the latest version of j - std - 020, lead free solder, 260 this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electro nic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level 1 at +260 c convection reflow the part is rated moisture sensitiv ity level 1 at 260c per jedec standard ipc/jedec j - std - 020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information ab out triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: applications.engineering@tqs.com important notice the information contained herein is believed to be reliable . triquint makes no warranties regarding the information contain ed herein . triquint assumes no responsibility or liability whatsoever for any of the information contained her ein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the informa tion contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual pro perty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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